[ Low Volume-Special Technology ] Manufacturer located in Taiwan UL approved, ISO9002, ISO14000 & QS9000 certificated Special material HIGH TG, GETEK, ROGERS, ARLON, NELCO, TEFLON, Aluminum and complex boards to CEM1, CEM3 & Standard FR-4 Material Layer count from 1L to 16L, 1oz to 8 oz copper, board thickness from 2mil to 400mil Various Furface Finishes: HASL, ENTEK, Immersion and electrolytic gold, Immersion Silver, Immersion Nikel, White Tin, Carbon Ink, Peelable Ink, Gold finger plating, Gold finger plating... Process for Blind Via, Buried Via, Control Impedance for 1. Characteristics Impedance and 2. Differential Impedance, Plugged Via, 10 colours choice for Solder Mask... Main product : Heavy copper, Back Plane, High TG, HDI, AuotMicrowave, Aluminum, IMS, Industrial and Auto PCB... Flexiable Q'ty from sample, polit run to mass production 2003-2007 © Castronic Inc. All right reserved.